ONSEMIC ARRAYJ-30035-16P-PCB
Photomultiplier 4×4 3mm Sensor Array , For Use with On Semiconductor ARRAYJ-BOB3-16P Breakout Boards
Band New and Sealed
Including 1 year warranty
The ARRAYJ−300XX−16P is comprised of 16 individual 3 mm J−Series sensors arranged in a 4 x 4 array.
There are two types: The ARRAYJ−30035−16P has pixels which are formed of 35 um microcells, and the ARRAYJ−30020−16P has pixels that are formed of 20 um microcells.
Connections to each sensor are provided by two 20−way Hirose plug−type board−to−board connectors, DF17(2.0)− 20DP−0.5V(57).
These connectors mate with the Hirose DF17(3.0)−20DS−0.5V(57).
The 16 SiPM pixels have all substrates (cathodes) connected together to form a common I/O.
The 20−way connector provides connections as follows:
• 16 x fast output
• 16 x standard I/O
• 8 x common I/O
• 4 x shield contacts to the Common
